{"doi":"10.7736/kspe.2013.30.9.943","title":"Characterization of Thermal Contact Resistance Doped with Thermal Interface Material","abstract":null,"journal":"Journal of the Korean Society for Precision Engineering","year":2013,"id":29313,"datarank":0.45073994902581294,"base_score":1.9459101490553132,"endowment":1.9459101490553132,"self_citation_contribution":0.29188652235829704,"citation_network_contribution":0.15885342666751587,"self_endowment_contribution":0.29188652235829704,"citer_contribution":0.15885342666751587,"corpus_percentile":null,"corpus_rank":null,"citation_count":6,"citer_count":5,"citers_with_citation_signal":3,"citers_with_endowment":3,"datacite_reuse_total":0,"is_dataset":false,"is_dataset_confidence":null,"is_data_producer":false,"deposit_databanks":null,"is_oa":false,"file_count":0,"downloads":0,"has_version_chain":false,"published_date":null,"fair_score":null,"fair_percentile":null,"algorithm_id":"datarank_citation_only_1hop_v6","ranking_scope":"data_only","authors":[{"id":161918,"name":"Yoshimi Ito","orcid":null,"position":1,"is_corresponding":false},{"id":161919,"name":"Wataru Nakayama","orcid":null,"position":2,"is_corresponding":false},{"id":161920,"name":"Byeong-Jun Moon","orcid":null,"position":3,"is_corresponding":false},{"id":161921,"name":"Sun-Kyu Lee","orcid":null,"position":4,"is_corresponding":false},{"id":161917,"name":"Iswor Bajracharya","orcid":null,"position":0,"is_corresponding":false}],"reference_count":0,"raw_metadata":{"has_enrichment":true,"base_score":1.9459101490553132,"endowment":1.9459101490553132,"datacite_reuse_total":0,"file_count":0,"downloads":0,"views":0,"has_version_chain":false,"is_dataset":false,"is_oa":false,"pmid":"24523987","pmcid":null,"openalex_id":"https://openalex.org/W2403835168","authors":[],"funders":[],"total_grants":0,"fwci":0.4682,"citation_percentile":0.73608482,"influential_citations":1,"citation_trend":[{"year":2015,"count":1},{"year":2019,"count":2},{"year":2021,"count":1},{"year":2022,"count":1},{"year":2026,"count":1}],"oa_status":"gold","license":"cc-by-nc","oa_locations":[{"url":"https://doi.org/10.7736/kspe.2013.30.9.943","host_type":"journal"},{"url":"https://doi.org/10.7736/kspe.2013.30.9.943","host_type":"publisher"},{"url":"http://ocean.kisti.re.kr/downfile/crosscheck/kspe/JAKO201326952133289.pdf","host_type":"publisher"}],"fields_of_study":["Adhesion, Friction, and Surface Interactions","Mechanical stress and fatigue analysis","Electrical Contact Performance and Analysis","Materials Science","Engineering","Physics"],"mesh_terms":[],"keywords":["Thermal grease","Thermal contact conductance","Materials science","Thermal resistance","Thermal conductivity","Thermal","Interfacial thermal resistance","Composite material","Thermal effusivity","Thermal contact","Thermal conduction","Contact resistance","Thermal bridge","Thermal transmittance","Thermal insulation","Thermodynamics","Layer (electronics)"],"sdg_mappings":[{"sdg_number":0,"sdg_label":"Affordable and clean energy"}],"linked_datasets":[],"clinical_trials":[],"software_tools":[],"database_accessions":[],"source":"live","citation_network_status":"fetched"},"created_at":"2026-06-08T23:14:40.869938Z","pmid":null,"pmcid":null,"fwci":null,"citation_percentile":null,"influential_citations":0,"oa_status":null,"license":null,"views":0,"total_file_size_bytes":0,"version_count":0,"fair_f":null,"fair_a":null,"fair_i":null,"fair_r":null,"fair_zscore":null,"fair_rationale":null,"fair_model":null,"fair_agent_version":null,"fair_fulltext_source":null,"fair_has_llm":null,"fair_computed_at":null,"clinical_trials":[],"software_tools":[],"db_accessions":[],"linked_datasets":[],"topics":[]}