{"doi":"10.5604/01.3001.0013.7915","title":"Application of the ASTM D5470 standard\ntest method for thermal conductivity\nmeasurements of high thermal conductive\nmaterials","abstract":"<jats:p>Purpose: The purpose of the present study was to demonstrate the procedure for\ndetermining the thermal conductivity of a solid material with relatively high thermal\nconductivity, using an original self-designed apparatus.\nDesign/methodology/approach: The thermal conductivity measurements have been\nperformed according to the ASTM D5470 standard. The thermal conductivity was calculated\nfrom the recorded temperature values in steady-state heat transfer conditions and\ndetermined heat flux.\nFindings: It has been found from the obtained experimental results that the applied\nstandard test method, which was initially introduced for thermal conductivity measurements\nof thermal interface materials (TIMs), is also suitable for materials with high thermal\nconductivity, giving reliable results.\nResearch limitations/implications: The ASTM D5470 standard test method for\nmeasurement of thermal conductivity usually gives poor results for high conductive materials\nhaving thermal conductivity above 100 W/mK, due to problems with measuring heat flux and\ntemperature drop across the investigated sample with reasonably high accuracy.\nPractical implications: The results obtained for the tested material show that the\npresented standard test method can also be used for materials with high thermal\nconductivity, which is of importance either for the industrial or laboratory applications.\nOriginality/value: The thermal conductivity measurements have been carried out using\nan original self-designed apparatus, which was developed for testing broad range of\nengineering materials with high accuracy.\n\n</jats:p>","journal":"Journal of Achievements in Materials and Manufacturing Engineering","year":2019,"id":28736,"datarank":1.084015628521903,"base_score":2.995732273553991,"endowment":2.995732273553991,"self_citation_contribution":0.4493598410330987,"citation_network_contribution":0.6346557874888044,"self_endowment_contribution":0.4493598410330987,"citer_contribution":0.6346557874888044,"corpus_percentile":null,"corpus_rank":null,"citation_count":19,"citer_count":19,"citers_with_citation_signal":14,"citers_with_endowment":14,"datacite_reuse_total":0,"is_dataset":false,"is_dataset_confidence":null,"is_data_producer":false,"deposit_databanks":null,"is_oa":false,"file_count":0,"downloads":0,"has_version_chain":false,"published_date":null,"fair_score":null,"fair_percentile":null,"algorithm_id":"datarank_citation_only_1hop_v6","ranking_scope":"data_only","authors":[{"id":160160,"name":"S. Pawlak","orcid":null,"position":1,"is_corresponding":false},{"id":160161,"name":"T. Krysiński","orcid":null,"position":2,"is_corresponding":false},{"id":160162,"name":"W. Adamczyk","orcid":null,"position":3,"is_corresponding":false},{"id":160163,"name":"R. Białecki","orcid":null,"position":4,"is_corresponding":false},{"id":160159,"name":"Z. Buliński","orcid":null,"position":0,"is_corresponding":false}],"reference_count":0,"raw_metadata":{"has_enrichment":true,"base_score":2.995732273553991,"endowment":2.995732273553991,"datacite_reuse_total":0,"file_count":0,"downloads":0,"views":0,"has_version_chain":false,"is_dataset":false,"is_oa":false,"pmid":"18998881","pmcid":null,"openalex_id":"https://openalex.org/W3004797313","authors":[],"funders":[],"total_grants":0,"fwci":0.4588,"citation_percentile":0.59131689,"influential_citations":0,"citation_trend":[{"year":2020,"count":1},{"year":2022,"count":4},{"year":2023,"count":3},{"year":2024,"count":5},{"year":2025,"count":5},{"year":2026,"count":1}],"oa_status":"closed","license":null,"oa_locations":[{"url":"https://doi.org/10.5604/01.3001.0013.7915","host_type":"journal"}],"fields_of_study":["Thermal properties of materials","Thermography and Photoacoustic Techniques","Advanced Sensor Technologies Research","Materials Science","Engineering"],"mesh_terms":[],"keywords":["Thermal conductivity","Thermal conductivity measurement","Materials science","Heat flux","Electrical conductor","Thermal conduction","Thermal","Thermal resistance","Heat transfer","Thermal transmittance","Composite material","Thermal grease","Thermal contact conductance","Test method","Thermal effusivity","Thermodynamics","Mathematics"],"sdg_mappings":[],"linked_datasets":[],"clinical_trials":[],"software_tools":[],"database_accessions":[],"source":"live","citation_network_status":"fetched"},"created_at":"2026-06-08T21:58:43.872988Z","pmid":null,"pmcid":null,"fwci":null,"citation_percentile":null,"influential_citations":0,"oa_status":null,"license":null,"views":0,"total_file_size_bytes":0,"version_count":0,"fair_f":null,"fair_a":null,"fair_i":null,"fair_r":null,"fair_zscore":null,"fair_rationale":null,"fair_model":null,"fair_agent_version":null,"fair_fulltext_source":null,"fair_has_llm":null,"fair_computed_at":null,"clinical_trials":[],"software_tools":[],"db_accessions":[],"linked_datasets":[],"topics":[]}