{"doi":"10.5104/jiep.4.68","title":"Extraction of Solder Constituent from CSP Boards by Means of X-ray Energy Subtraction Method.","abstract":null,"journal":"Journal of Japan Institute of Electronics Packaging","year":2001,"id":649267,"datarank":0.29188652235829704,"base_score":1.9459101490553132,"endowment":1.9459101490553132,"self_citation_contribution":0.29188652235829704,"citation_network_contribution":0.0,"self_endowment_contribution":0.29188652235829704,"citer_contribution":0.0,"corpus_percentile":null,"corpus_rank":null,"citation_count":6,"citer_count":0,"citers_with_citation_signal":0,"citers_with_endowment":0,"datacite_reuse_total":0,"is_dataset":false,"is_dataset_confidence":null,"is_data_producer":false,"deposit_databanks":null,"is_oa":false,"file_count":0,"downloads":0,"has_version_chain":false,"published_date":null,"fair_score":null,"fair_percentile":null,"algorithm_id":"datarank_citation_only_1hop_v6","ranking_scope":"data_only","authors":[{"id":1692469,"name":"Isao HORIBA","orcid":null,"position":1,"is_corresponding":false},{"id":1692468,"name":"Atsushi TERAMOTO","orcid":null,"position":0,"is_corresponding":false}],"reference_count":0,"raw_metadata":{"has_enrichment":true,"resolved":true,"title":"Extraction of Solder Constituent from CSP Boards by Means of X-ray Energy Subtraction Method.","abstract":"With the high requirement of high-density packaging, CSP have been spread widely. To inspect the solder joint in CSP, an X-ray image has been used. However, an X-ray image contains not only solder joint but also capper leads. Therefore, it is very difficult to analyze the solder with robustness. In this paper, we propose a new method for extracting the solder constituent by means of Energy Subtraction. In the experience, we compared the performance of thick measurement between regular X-ray Image and Subtraction image. The result shows the advantageous performance of Subtraction method over regular one.","is_dataset_classified":null,"base_score":1.9459101490553132,"endowment":1.9459101490553132,"datacite_reuse_total":0,"file_count":0,"downloads":0,"views":0,"has_version_chain":false,"is_dataset":false,"is_oa":false,"pmid":"19965766","pmcid":null,"openalex_id":"https://openalex.org/W2330962891","authors":[],"funders":[],"total_grants":0,"fwci":0.0,"citation_percentile":0.29083799,"influential_citations":0,"citation_trend":[{"year":2013,"count":1},{"year":2016,"count":1}],"oa_status":"bronze","license":null,"oa_locations":[{"url":"https://www.jstage.jst.go.jp/article/jiep1998/4/1/4_1_68/_pdf","host_type":"journal"},{"url":"https://doi.org/10.5104/jiep.4.68","host_type":"journal"}],"fields_of_study":["Industrial Vision Systems and Defect Detection","Advancements in Photolithography Techniques","Electron and X-Ray Spectroscopy Techniques"],"mesh_terms":[],"keywords":["Soldering","Subtraction","Image subtraction","Robustness (evolution)","Computer science","Materials science","Artificial intelligence","Joint (building)","Image (mathematics)","Computer vision","Image processing","Mathematics","Composite material","Engineering","Structural engineering","Arithmetic","Chemistry","Binary image"],"sdg_mappings":[{"sdg_number":0,"sdg_label":"Affordable and clean energy"}],"linked_datasets":[],"clinical_trials":[],"software_tools":[],"database_accessions":[],"source":"live","citation_network_status":"fetched"},"created_at":"2026-08-10T03:27:03.253564Z","pmid":null,"pmcid":null,"fwci":null,"citation_percentile":null,"influential_citations":0,"oa_status":null,"license":null,"views":0,"total_file_size_bytes":0,"version_count":0,"fair_f":null,"fair_a":null,"fair_i":null,"fair_r":null,"fair_zscore":null,"fair_rationale":null,"fair_model":null,"fair_agent_version":null,"fair_fulltext_source":null,"fair_has_llm":null,"fair_computed_at":null,"clinical_trials":[],"software_tools":[],"db_accessions":[],"linked_datasets":[],"topics":[]}