{"doi":"10.31438/trf.hh2024.110","title":"AN SOI-PCB WITH THERMOCOMPRESSION BONDED CMOS, MULTILAYER WIRING, NATIVE MEMS","abstract":"In this paper, we introduce a silicon-on-insulator (SOI) platform that integrates MEMS and foundry-fabricated CMOS integrated circuits through a thermocompression bonding (TCB) process.This compact design features chip-level integration with a 5 m pitch and multilayer electrical connectivity.The electrical interface comprises a three-layer metal stack -Chromium, Platinum, and Gold -deposited on polysilicon and silicon nitride insulation layers.The device employs a two-layer wiring scheme enabled by Au-Au TCB.We assess the bonding strength and electrical properties, including the resistance of metal traces, interlayer vias, and MEMS contacts on two 2 2 cm 2 SOI-PCB chiplets.Further, we perform heterogeneous integration between the foundry-fabricated CMOS and the SOI-PCB, utilizing TCB for the interface between CMOS copper bumping and gold traces.We conduct comprehensive tests of electrical connectivity, power characterization, and demonstrate chip bring-up conducted across the SOI-PCB interface.","journal":null,"year":2024,"id":508548,"datarank":0.0,"base_score":0.0,"endowment":0.0,"self_citation_contribution":0.0,"citation_network_contribution":0.0,"self_endowment_contribution":0.0,"citer_contribution":0.0,"corpus_percentile":null,"corpus_rank":null,"citation_count":0,"citer_count":0,"citers_with_citation_signal":0,"citers_with_endowment":0,"datacite_reuse_total":0,"is_dataset":false,"is_dataset_confidence":0.9503,"is_data_producer":false,"deposit_databanks":null,"is_oa":true,"file_count":0,"downloads":0,"has_version_chain":false,"published_date":"2024-01-01","fair_score":null,"fair_percentile":null,"algorithm_id":"datarank_citation_only_1hop_v6","ranking_scope":"data_only","authors":[{"id":1360571,"name":"Daniel Lovell","orcid":null,"position":1,"is_corresponding":false},{"id":1359091,"name":"Kristofer S. J. Pister","orcid":"0000-0002-8108-2102","position":2,"is_corresponding":false},{"id":1185907,"name":"Yichen Liu","orcid":"0000-0003-0950-3248","position":0,"is_corresponding":true}],"reference_count":6,"raw_metadata":null,"created_at":"2026-07-19T02:11:10.049781Z","pmid":null,"pmcid":null,"fwci":null,"citation_percentile":null,"influential_citations":0,"oa_status":null,"license":null,"views":0,"total_file_size_bytes":0,"version_count":0,"fair_f":null,"fair_a":null,"fair_i":null,"fair_r":null,"fair_zscore":null,"fair_rationale":null,"fair_model":null,"fair_agent_version":null,"fair_fulltext_source":null,"fair_has_llm":null,"fair_computed_at":null,"clinical_trials":[],"software_tools":[],"db_accessions":[],"linked_datasets":[],"topics":[]}