{"doi":"10.3139/146.101760","title":"Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints","abstract":"<jats:title>Abstract</jats:title>\n               <jats:p>Interfacial reactions and mechanical properties between the Cu and Pb-free solders, Sn-3.0Ag-0.5Cu and Sn-58Bi with addition of 0.1 to 1.0 wt.% Pb are investigated in this study. Two kinds of intermetallic compounds, scallop-shaped Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> and plane layered Cu<jats:sub>3</jats:sub>Sn phases, were found in both Sn-3.0Ag-0.5Cu + Pb/Cu and Sn-58Bi + Pb/Cu couples. The intermetallic compound thickness increased with longer reaction times, higher reaction temperatures and greater Pb contents. The Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> phase was the thicker intermetallic compound in the Sn-3.0Ag-0.5Cu + Pb/Cu couple. However, in the Sn-58Bi + Pb/Cu system, the Cu<jats:sub>3</jats:sub>Sn phase is the thicker intermetallic compound. Experimental results indicate that the higher Pb concentration in Sn-3.0Ag-0.5Cu or Sn-58Bi solders reduces the alloy liquidus temperature and increases the thickness of the intermetallic compound. Thicker intermetallic compounds reduce the mechanical strength of the solder joint.</jats:p>","journal":"International Journal of Materials Research","year":2008,"id":17389,"datarank":0.3433262359590458,"base_score":1.6094379124341003,"endowment":1.6094379124341003,"self_citation_contribution":0.24141568686511508,"citation_network_contribution":0.10191054909393076,"self_endowment_contribution":0.24141568686511508,"citer_contribution":0.10191054909393076,"corpus_percentile":null,"corpus_rank":null,"citation_count":4,"citer_count":1,"citers_with_citation_signal":1,"citers_with_endowment":1,"datacite_reuse_total":0,"is_dataset":false,"is_dataset_confidence":null,"is_data_producer":false,"deposit_databanks":null,"is_oa":false,"file_count":0,"downloads":0,"has_version_chain":false,"published_date":null,"fair_score":null,"fair_percentile":null,"algorithm_id":"datarank_citation_only_1hop_v6","ranking_scope":"data_only","authors":[{"id":124602,"name":"Weng-Ting Chou","orcid":null,"position":1,"is_corresponding":false},{"id":124603,"name":"Hong-Chih Chen","orcid":null,"position":2,"is_corresponding":false},{"id":124604,"name":"Wei-Kai Liou","orcid":null,"position":3,"is_corresponding":false},{"id":124605,"name":"Chiapyng Lee","orcid":null,"position":4,"is_corresponding":false},{"id":124601,"name":"Yee-Wen Yen","orcid":null,"position":0,"is_corresponding":false}],"reference_count":0,"raw_metadata":{"has_enrichment":true,"base_score":1.6094379124341003,"endowment":1.6094379124341003,"datacite_reuse_total":0,"file_count":0,"downloads":0,"views":0,"has_version_chain":false,"is_dataset":false,"is_oa":false,"pmid":"21071399","pmcid":null,"openalex_id":"https://openalex.org/W2036820308","authors":[],"funders":[],"total_grants":0,"fwci":0.6783,"citation_percentile":0.72324569,"influential_citations":0,"citation_trend":[{"year":2012,"count":1},{"year":2018,"count":1}],"oa_status":"closed","license":null,"oa_locations":[{"url":"https://www.degruyter.com/view/journals/ijmr/99/11/article-p1256.xml","host_type":"publisher"},{"url":"https://www.degruyterbrill.com/document/doi/10.3139/146.101760/xml","host_type":"publisher"},{"url":"https://www.degruyterbrill.com/document/doi/10.3139/146.101760/pdf","host_type":"publisher"},{"url":"https://doi.org/10.3139/146.101760","host_type":"journal"}],"fields_of_study":["Electronic Packaging and Soldering Technologies","3D IC and TSV technologies","Aluminum Alloys Composites Properties","Materials Science","Engineering"],"mesh_terms":[],"keywords":["Intermetallic","Soldering","Materials science","Liquidus","Alloy","Metallurgy","Phase (matter)","Tin","Composite material","Chemistry"],"sdg_mappings":[],"linked_datasets":[],"clinical_trials":[],"software_tools":[],"database_accessions":[],"source":"live","citation_network_status":"fetched"},"created_at":"2026-06-02T18:40:22.704551Z","pmid":null,"pmcid":null,"fwci":null,"citation_percentile":null,"influential_citations":0,"oa_status":null,"license":null,"views":0,"total_file_size_bytes":0,"version_count":0,"fair_f":null,"fair_a":null,"fair_i":null,"fair_r":null,"fair_zscore":null,"fair_rationale":null,"fair_model":null,"fair_agent_version":null,"fair_fulltext_source":null,"fair_has_llm":null,"fair_computed_at":null,"clinical_trials":[],"software_tools":[],"db_accessions":[],"linked_datasets":[],"topics":[]}