{"doi":"10.1299/jsmeted.2012.235","title":"H121 Heat Transfer Path of The Microprocessor Thermal Resistance Expression in Thermal Network","abstract":null,"journal":"The Proceedings of the Thermal Engineering Conference","year":2012,"id":29143,"datarank":0.0,"base_score":0.0,"endowment":0.0,"self_citation_contribution":0.0,"citation_network_contribution":0.0,"self_endowment_contribution":0.0,"citer_contribution":0.0,"corpus_percentile":null,"corpus_rank":null,"citation_count":0,"citer_count":0,"citers_with_citation_signal":0,"citers_with_endowment":0,"datacite_reuse_total":0,"is_dataset":false,"is_dataset_confidence":null,"is_data_producer":false,"deposit_databanks":null,"is_oa":false,"file_count":0,"downloads":0,"has_version_chain":false,"published_date":null,"fair_score":null,"fair_percentile":null,"algorithm_id":"datarank_citation_only_1hop_v6","ranking_scope":"data_only","authors":[{"id":154886,"name":"Masaru Ishizuka","orcid":null,"position":1,"is_corresponding":false},{"id":154884,"name":"Tomoyuki Hatakeyama","orcid":null,"position":0,"is_corresponding":false}],"reference_count":0,"raw_metadata":{"has_enrichment":true,"base_score":0.0,"endowment":0.0,"datacite_reuse_total":0,"file_count":0,"downloads":0,"views":0,"has_version_chain":false,"is_dataset":false,"is_oa":false,"pmid":"24523987","pmcid":null,"openalex_id":"https://openalex.org/W2729659941","authors":[],"funders":[],"total_grants":0,"fwci":0.0,"citation_percentile":0.48013322,"influential_citations":0,"citation_trend":[],"oa_status":"gold","license":null,"oa_locations":[{"url":"https://www.jstage.jst.go.jp/article/jsmeted/2012/0/2012_235/_pdf","host_type":"journal"},{"url":"https://doi.org/10.1299/jsmeted.2012.235","host_type":"BRONZE"},{"url":"https://www.jstage.jst.go.jp/article/jsmeted/2012/0/2012_235/_pdf","host_type":"publisher"}],"fields_of_study":["Heat Transfer and Optimization","3D IC and TSV technologies","Materials Science","Engineering","Physics"],"mesh_terms":[],"keywords":["Thermal conduction","Heat sink","Thermal resistance","Heat transfer","Transient (computer programming)","Temperature gradient","Materials science","Thermal","Thermal conductivity","Mechanics","Transient state","Thermodynamics","Computer science","Composite material","Engineering","Electrical engineering","Physics","Meteorology"],"sdg_mappings":[{"sdg_number":0,"sdg_label":"Affordable and clean energy"}],"linked_datasets":[],"clinical_trials":[],"software_tools":[],"database_accessions":[],"source":"live","citation_network_status":"fetched"},"created_at":"2026-06-08T22:43:14.060798Z","pmid":null,"pmcid":null,"fwci":null,"citation_percentile":null,"influential_citations":0,"oa_status":null,"license":null,"views":0,"total_file_size_bytes":0,"version_count":0,"fair_f":null,"fair_a":null,"fair_i":null,"fair_r":null,"fair_zscore":null,"fair_rationale":null,"fair_model":null,"fair_agent_version":null,"fair_fulltext_source":null,"fair_has_llm":null,"fair_computed_at":null,"clinical_trials":[],"software_tools":[],"db_accessions":[],"linked_datasets":[],"topics":[]}