{"doi":"10.1143/jjap.37.5849","title":"Control of Microscratches in Chemical-Mechanical Polishing Process for Shallow Trench Isolation","abstract":"<jats:p> \n  A method of controlling microscratches on silicon oxide surfaces induced  \n  by chemical-mechanical polishing (CMP) process for the planarization of  \n  shallow trench isolation is discussed. The frequency of microscratches  \n  during polishing shows its high dependency on the characteristics of CMP  \n  consumables such as slurry and pad. A diluted slurry solution, pH-controlled  \n  with a potassium hydroxide (KOH) solution of pH 13, produces  \n  best results in reducing microscratches on silicon oxide surfaces during  \n  polishing. In conclusion, careful preparation of the CMP consumables is  \n  required to reduce microscratches on silicon oxide during polishing. \n  </jats:p>","journal":"Japanese Journal of Applied Physics","year":1998,"id":43627,"datarank":3.414373103055813,"base_score":2.8903717578961645,"endowment":2.8903717578961645,"self_citation_contribution":0.4335557636844247,"citation_network_contribution":2.9808173393713884,"self_endowment_contribution":0.4335557636844247,"citer_contribution":2.9808173393713884,"corpus_percentile":null,"corpus_rank":null,"citation_count":17,"citer_count":17,"citers_with_citation_signal":16,"citers_with_endowment":16,"datacite_reuse_total":0,"is_dataset":false,"is_dataset_confidence":null,"is_data_producer":false,"deposit_databanks":null,"is_oa":false,"file_count":0,"downloads":0,"has_version_chain":false,"published_date":null,"fair_score":null,"fair_percentile":null,"algorithm_id":"datarank_citation_only_1hop_v6","ranking_scope":"data_only","authors":[{"id":206894,"name":"Kwang-Bok Kim","orcid":null,"position":1,"is_corresponding":false},{"id":206895,"name":"Chang-Ki Hong","orcid":null,"position":2,"is_corresponding":false},{"id":206896,"name":"U-In Chung","orcid":null,"position":3,"is_corresponding":false},{"id":206897,"name":"Moon-Yong Lee","orcid":null,"position":4,"is_corresponding":false},{"id":206893,"name":"Heungsoo Park","orcid":null,"position":0,"is_corresponding":false}],"reference_count":0,"raw_metadata":{"has_enrichment":true,"base_score":2.8903717578961645,"endowment":2.8903717578961645,"datacite_reuse_total":0,"file_count":0,"downloads":0,"views":0,"has_version_chain":false,"is_dataset":false,"is_oa":false,"pmid":"21464855","pmcid":null,"openalex_id":"https://openalex.org/W2064289321","authors":[],"funders":[],"total_grants":0,"fwci":0.0,"citation_percentile":0.15752863,"influential_citations":0,"citation_trend":[],"oa_status":"closed","license":"https://iopscience.iop.org/info/page/text-and-data-mining","oa_locations":[{"url":"https://iopscience.iop.org/article/10.1143/JJAP.37.5849","host_type":"publisher"},{"url":"https://iopscience.iop.org/article/10.1143/JJAP.37.5849/pdf","host_type":"publisher"},{"url":"https://doi.org/10.1143/jjap.37.5849","host_type":"journal"}],"fields_of_study":["Advanced Surface Polishing Techniques","Advanced machining processes and optimization","Diamond and Carbon-based Materials Research","Physics","Engineering","Materials Science"],"mesh_terms":[],"keywords":["Chemical-mechanical planarization","Consumables","Shallow trench isolation","Polishing","Slurry","Oxide","Materials science","Potassium hydroxide","Trench","Silicon","Metallurgy","Composite material","Chemical engineering","Chemistry","Layer (electronics)"],"sdg_mappings":[{"sdg_number":0,"sdg_label":"Life below water"}],"linked_datasets":[],"clinical_trials":[],"software_tools":[],"database_accessions":[],"source":"live","citation_network_status":"fetched"},"created_at":"2026-06-15T01:41:48.643060Z","pmid":null,"pmcid":null,"fwci":null,"citation_percentile":null,"influential_citations":0,"oa_status":null,"license":null,"views":0,"total_file_size_bytes":0,"version_count":0,"fair_f":null,"fair_a":null,"fair_i":null,"fair_r":null,"fair_zscore":null,"fair_rationale":null,"fair_model":null,"fair_agent_version":null,"fair_fulltext_source":null,"fair_has_llm":null,"fair_computed_at":null,"clinical_trials":[],"software_tools":[],"db_accessions":[],"linked_datasets":[],"topics":[]}