{"doi":"10.1117/12.499077","title":"Adhesive wafer bonding for MEMS applications","abstract":null,"journal":"SPIE Proceedings","year":2003,"id":684011,"datarank":0.5897738449086489,"base_score":3.9318256327243257,"endowment":3.9318256327243257,"self_citation_contribution":0.5897738449086489,"citation_network_contribution":0.0,"self_endowment_contribution":0.5897738449086489,"citer_contribution":0.0,"corpus_percentile":null,"corpus_rank":null,"citation_count":50,"citer_count":0,"citers_with_citation_signal":0,"citers_with_endowment":0,"datacite_reuse_total":0,"is_dataset":false,"is_dataset_confidence":null,"is_data_producer":false,"deposit_databanks":null,"is_oa":false,"file_count":0,"downloads":0,"has_version_chain":false,"published_date":null,"fair_score":null,"fair_percentile":null,"algorithm_id":"datarank_citation_only_1hop_v6","ranking_scope":"data_only","authors":[{"id":1786942,"name":"Thomas Glinsner","orcid":null,"position":1,"is_corresponding":false},{"id":1786943,"name":"Gerald Mittendorfer","orcid":null,"position":2,"is_corresponding":false},{"id":1786944,"name":"Bernhard Wieder","orcid":null,"position":3,"is_corresponding":false},{"id":1786945,"name":"Paul Lindner","orcid":null,"position":4,"is_corresponding":false},{"id":1786941,"name":"Viorel Dragoi","orcid":null,"position":0,"is_corresponding":false}],"reference_count":0,"raw_metadata":{"has_enrichment":true,"resolved":true,"title":"Adhesive wafer bonding for MEMS applications","abstract":"Low temperature wafer bonding is a powerful technique for MEMS/MOEMS devices fabrication and packaging. Among the low temperature processes adhesive bonding focuses a high technological interest. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). The main advantages of this method are: surface planarization, encapsulation of structures on the wafer surface, particle compensation and decrease of annealing temperature after bonding. This paper presents results on adhesive bonding using spin-on glass and Benzocyclobutene (BCB) from Dow Chemicals. The advantages of using adhesive bonding for MEMS applications will be illustrated be presenting a technology of fabricating GaAs-on-Si substrates (up to 150 mm diameter) and results on BCB bonding of Si wafers (200 mm diameter).","is_dataset_classified":null,"base_score":3.9318256327243257,"endowment":3.9318256327243257,"datacite_reuse_total":0,"file_count":0,"downloads":0,"views":0,"has_version_chain":false,"is_dataset":false,"is_oa":false,"pmid":"26207759","pmcid":null,"openalex_id":"https://openalex.org/W2036356183","authors":[],"funders":[],"total_grants":0,"fwci":3.0154,"citation_percentile":0.91454313,"influential_citations":0,"citation_trend":[{"year":2012,"count":2},{"year":2013,"count":1},{"year":2014,"count":5},{"year":2015,"count":4},{"year":2016,"count":7},{"year":2017,"count":3},{"year":2018,"count":1},{"year":2019,"count":2},{"year":2020,"count":1},{"year":2021,"count":1},{"year":2022,"count":1},{"year":2025,"count":2}],"oa_status":"closed","license":null,"oa_locations":[{"url":"http://proceedings.spiedigitallibrary.org/proceeding.aspx?doi=10.1117/12.499077","host_type":"publisher"},{"url":"https://doi.org/10.1117/12.499077","host_type":"journal"}],"fields_of_study":["3D IC and TSV technologies","Electronic Packaging and Soldering Technologies","Semiconductor Lasers and Optical Devices"],"mesh_terms":[],"keywords":["Materials science","Benzocyclobutene","Wafer bonding","Adhesive","Microelectromechanical systems","Wafer","Anodic bonding","Adhesive bonding","Chemical-mechanical planarization","Fabrication","Composite material","Annealing (glass)","Thermocompression bonding","Wire bonding","Polymer","Optoelectronics","Nanotechnology","Polishing","Layer (electronics)","Chip","Electrical engineering"],"sdg_mappings":[],"linked_datasets":[],"clinical_trials":[],"software_tools":[],"database_accessions":[],"source":"live","citation_network_status":"fetched"},"created_at":"2026-08-18T13:03:17.403123Z","pmid":null,"pmcid":null,"fwci":null,"citation_percentile":null,"influential_citations":0,"oa_status":null,"license":null,"views":0,"total_file_size_bytes":0,"version_count":0,"fair_f":null,"fair_a":null,"fair_i":null,"fair_r":null,"fair_zscore":null,"fair_rationale":null,"fair_model":null,"fair_agent_version":null,"fair_fulltext_source":null,"fair_has_llm":null,"fair_computed_at":null,"clinical_trials":[],"software_tools":[],"db_accessions":[],"linked_datasets":[],"topics":[]}