{"doi":"10.1115/imece2005-82505","title":"Low Cost Metal Mini-Cap Process for Suspended MEMS Device Packaging","abstract":"<jats:p>A new wafer capping process is investigated in this study. The objective of this study is to come out a simple and low cost wafer capping process to make the capped MEMS device wafers “transparent” to traditional IC assembly processes. The carrier wafers with metal mini-caps are bonded on the MEMS device wafers through solder bonding, and the mini-caps are then transferred and left on the MEMS device wafer through a selective etching of the carrier wafers. The metal mini-cap capped device wafers are virtually of the same thickness as original ones; in addition, the transferred metal mini-caps provide a mechanical protection to the MEMS devices during the consequent assembly processes such as wafer dicing, die bonding, molding, etc. With an additional design of 2nd level interconnection on the mini-cap carrier wafer, the transferred MEMS device wafers can be singulated and become a wafer level package with compliant leads.</jats:p>","journal":"Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology","year":2005,"id":674626,"datarank":0.0,"base_score":0.0,"endowment":0.0,"self_citation_contribution":0.0,"citation_network_contribution":0.0,"self_endowment_contribution":0.0,"citer_contribution":0.0,"corpus_percentile":null,"corpus_rank":null,"citation_count":0,"citer_count":0,"citers_with_citation_signal":0,"citers_with_endowment":0,"datacite_reuse_total":0,"is_dataset":false,"is_dataset_confidence":null,"is_data_producer":false,"deposit_databanks":null,"is_oa":false,"file_count":0,"downloads":0,"has_version_chain":false,"published_date":null,"fair_score":null,"fair_percentile":null,"algorithm_id":"datarank_citation_only_1hop_v6","ranking_scope":"data_only","authors":[{"id":1762633,"name":"Leonardo Wang","orcid":null,"position":1,"is_corresponding":false},{"id":1762634,"name":"W. 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The metal mini-cap capped device wafers are virtually of the same thickness as original ones; in addition, the transferred metal mini-caps provide a mechanical protection to the MEMS devices during the consequent assembly processes such as wafer dicing, die bonding, molding, etc. With an additional design of 2nd level interconnection on the mini-cap carrier wafer, the transferred MEMS device wafers can be singulated and become a wafer level package with compliant leads.</jats:p>","is_dataset_classified":null,"base_score":0.0,"endowment":0.0,"datacite_reuse_total":0,"file_count":0,"downloads":0,"views":0,"has_version_chain":false,"is_dataset":false,"is_oa":false,"pmid":"19162232","pmcid":null,"openalex_id":"https://openalex.org/W2075893297","authors":[],"funders":[],"total_grants":0,"fwci":0.0,"citation_percentile":0.22477348,"influential_citations":0,"citation_trend":[],"oa_status":"closed","license":null,"oa_locations":[{"url":"http://asmedigitalcollection.asme.org/IMECE/proceedings-pdf/doi/10.1115/IMECE2005-82505/2633633/569_1.pdf","host_type":"publisher"},{"url":"https://doi.org/10.1115/imece2005-82505","host_type":"journal"}],"fields_of_study":["3D IC and TSV technologies","Electronic Packaging and Soldering Technologies","Advanced MEMS and NEMS Technologies"],"mesh_terms":[],"keywords":["Wafer","Wafer dicing","Die preparation","Microelectromechanical systems","Materials science","Wafer testing","Wafer backgrinding","Wafer bonding","Wafer-level packaging","Etching (microfabrication)","Interconnection","Optoelectronics","Die (integrated circuit)","Soldering","Nanotechnology","Composite material","Computer science","Layer (electronics)"],"sdg_mappings":[],"linked_datasets":[],"clinical_trials":[],"software_tools":[],"database_accessions":[],"source":"live","citation_network_status":"fetched"},"created_at":"2026-08-16T17:35:24.299471Z","pmid":null,"pmcid":null,"fwci":null,"citation_percentile":null,"influential_citations":0,"oa_status":null,"license":null,"views":0,"total_file_size_bytes":0,"version_count":0,"fair_f":null,"fair_a":null,"fair_i":null,"fair_r":null,"fair_zscore":null,"fair_rationale":null,"fair_model":null,"fair_agent_version":null,"fair_fulltext_source":null,"fair_has_llm":null,"fair_computed_at":null,"clinical_trials":[],"software_tools":[],"db_accessions":[],"linked_datasets":[],"topics":[]}