{"doi":"10.1109/ted.2021.3084551","title":"Investigation Regarding the Influence of Contact Condition on the Thermal Contact Resistance Between Copper and Indium","abstract":null,"journal":"IEEE Transactions on Electron Devices","year":2021,"id":28892,"datarank":0.9522478009740746,"base_score":2.8903717578961645,"endowment":2.8903717578961645,"self_citation_contribution":0.4335557636844247,"citation_network_contribution":0.5186920372896499,"self_endowment_contribution":0.4335557636844247,"citer_contribution":0.5186920372896499,"corpus_percentile":null,"corpus_rank":null,"citation_count":17,"citer_count":14,"citers_with_citation_signal":11,"citers_with_endowment":11,"datacite_reuse_total":0,"is_dataset":false,"is_dataset_confidence":null,"is_data_producer":false,"deposit_databanks":null,"is_oa":false,"file_count":0,"downloads":0,"has_version_chain":false,"published_date":null,"fair_score":null,"fair_percentile":null,"algorithm_id":"datarank_citation_only_1hop_v6","ranking_scope":"data_only","authors":[{"id":160660,"name":"Chenzefang Feng","orcid":null,"position":1,"is_corresponding":false},{"id":160661,"name":"Ben Shen","orcid":null,"position":2,"is_corresponding":false},{"id":160662,"name":"Zhou Hu","orcid":null,"position":3,"is_corresponding":false},{"id":160663,"name":"Fulong Zhu","orcid":"0000-0002-0756-9051","position":4,"is_corresponding":false},{"id":160659,"name":"Jianxiong Hu","orcid":"0000-0003-3543-9120","position":0,"is_corresponding":false}],"reference_count":0,"raw_metadata":{"has_enrichment":true,"base_score":2.8903717578961645,"endowment":2.8903717578961645,"datacite_reuse_total":0,"file_count":0,"downloads":0,"views":0,"has_version_chain":false,"is_dataset":false,"is_oa":false,"pmid":"24523987","pmcid":null,"openalex_id":"https://openalex.org/W3169584498","authors":[],"funders":[{"funder_name":"National Natural Science Foundation of China","grant_id":"U20A6004","title":null},{"funder_name":"National Natural Science Foundation of China","grant_id":"52075208","title":null}],"total_grants":2,"fwci":1.7799,"citation_percentile":0.82301975,"influential_citations":0,"citation_trend":[{"year":2023,"count":5},{"year":2024,"count":7},{"year":2025,"count":5}],"oa_status":"closed","license":"https://doi.org/10.15223/policy-029","oa_locations":[{"url":"http://xplorestaging.ieee.org/ielx7/16/9493680/09452066.pdf?arnumber=9452066","host_type":"publisher"},{"url":"https://doi.org/10.1109/ted.2021.3084551","host_type":"journal"}],"fields_of_study":["Adhesion, Friction, and Surface Interactions","Electronic Packaging and Soldering Technologies","Electrical Contact Performance and Analysis","Materials Science","Engineering"],"mesh_terms":[],"keywords":["Thermal contact conductance","Contact resistance","Materials science","Thermal grease","Thermal resistance","Interfacial thermal resistance","Copper","Indium","Surface roughness","Composite material","Surface finish","Thermal conductivity","Microelectronics","Thermal contact","Thermal","Contact area","Metallurgy","Layer (electronics)","Thermodynamics","Optoelectronics"],"sdg_mappings":[],"linked_datasets":[],"clinical_trials":[],"software_tools":[],"database_accessions":[],"source":"live","citation_network_status":"fetched"},"created_at":"2026-06-08T22:18:49.913760Z","pmid":null,"pmcid":null,"fwci":null,"citation_percentile":null,"influential_citations":0,"oa_status":null,"license":null,"views":0,"total_file_size_bytes":0,"version_count":0,"fair_f":null,"fair_a":null,"fair_i":null,"fair_r":null,"fair_zscore":null,"fair_rationale":null,"fair_model":null,"fair_agent_version":null,"fair_fulltext_source":null,"fair_has_llm":null,"fair_computed_at":null,"clinical_trials":[],"software_tools":[],"db_accessions":[],"linked_datasets":[],"topics":[]}