{"doi":"10.1016/j.protcy.2015.07.003","title":"Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods","abstract":null,"journal":"Procedia Technology","year":2015,"id":651397,"datarank":0.29188652235829704,"base_score":1.9459101490553132,"endowment":1.9459101490553132,"self_citation_contribution":0.29188652235829704,"citation_network_contribution":0.0,"self_endowment_contribution":0.29188652235829704,"citer_contribution":0.0,"corpus_percentile":null,"corpus_rank":null,"citation_count":6,"citer_count":0,"citers_with_citation_signal":0,"citers_with_endowment":0,"datacite_reuse_total":0,"is_dataset":false,"is_dataset_confidence":null,"is_data_producer":false,"deposit_databanks":null,"is_oa":false,"file_count":0,"downloads":0,"has_version_chain":false,"published_date":null,"fair_score":null,"fair_percentile":null,"algorithm_id":"datarank_citation_only_1hop_v6","ranking_scope":"data_only","authors":[{"id":1698825,"name":"Suhana Binti Mohd Said","orcid":null,"position":1,"is_corresponding":false},{"id":1698826,"name":"Dhafer Abdulameer Shnawah","orcid":null,"position":2,"is_corresponding":false},{"id":1698824,"name":"Mohd Faizul Mohd Sabri","orcid":null,"position":0,"is_corresponding":false}],"reference_count":0,"raw_metadata":{"has_enrichment":true,"resolved":true,"title":"Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods","abstract":"In this work, we investigate the effects of 0.1 and 0.5 wt.% Al additions on the wettability of Sn-1Ag-0.5Cu solder on a Cu substrate. Spread area and wetting balance methods were used to evaluate the wettability of the solders. The results of both tests show that the addition of 0.1 wt.% Al does slightly improve the wetting properties of the Sn-1Ag-0.5Cu solder, whereas the addition of 0.5 wt.% Al worsens the wetting properties.","is_dataset_classified":null,"base_score":1.9459101490553132,"endowment":1.9459101490553132,"datacite_reuse_total":0,"file_count":0,"downloads":0,"views":0,"has_version_chain":false,"is_dataset":false,"is_oa":false,"pmid":"19965766","pmcid":null,"openalex_id":"https://openalex.org/W1169125209","authors":[],"funders":[],"total_grants":0,"fwci":0.1604,"citation_percentile":0.57427376,"influential_citations":0,"citation_trend":[{"year":2016,"count":1},{"year":2020,"count":2},{"year":2021,"count":1},{"year":2022,"count":2}],"oa_status":"gold","license":"cc-by-nc-nd","oa_locations":[{"url":"https://www.sciencedirect.com/science/article/pii/S2212017315001802/pdf","host_type":"journal"},{"url":"https://www.sciencedirect.com/science/article/pii/S2212017315001802/pdf","host_type":"publisher"},{"url":"https://api.elsevier.com/content/article/PII:S2212017315001802?httpAccept=text/xml","host_type":"publisher"},{"url":"https://api.elsevier.com/content/article/PII:S2212017315001802?httpAccept=text/plain","host_type":"publisher"},{"url":"https://doi.org/10.1016/j.protcy.2015.07.003","host_type":"journal"},{"url":"https://figshare.com/articles/conference_contribution/Wetting_characteristics_of_Al-containing_Sn-1Ag-0_5Cu_solder_alloy_on_Cu_substrate_using_wetting_balance_and_spread_area_methods/20818684","host_type":"repository"}],"fields_of_study":["Electronic Packaging and Soldering Technologies","3D IC and TSV technologies","Advanced Welding Techniques Analysis"],"mesh_terms":[],"keywords":["Wetting","Soldering","Materials science","Substrate (aquarium)","Contact angle","Alloy","Metallurgy","Composite material","Balance test","Balance (ability)"],"sdg_mappings":[{"sdg_number":0,"sdg_label":"Clean water and sanitation"}],"linked_datasets":[],"clinical_trials":[],"software_tools":[],"database_accessions":[],"source":"live","citation_network_status":"fetched"},"created_at":"2026-08-10T08:54:03.946887Z","pmid":null,"pmcid":null,"fwci":null,"citation_percentile":null,"influential_citations":0,"oa_status":null,"license":null,"views":0,"total_file_size_bytes":0,"version_count":0,"fair_f":null,"fair_a":null,"fair_i":null,"fair_r":null,"fair_zscore":null,"fair_rationale":null,"fair_model":null,"fair_agent_version":null,"fair_fulltext_source":null,"fair_has_llm":null,"fair_computed_at":null,"clinical_trials":[],"software_tools":[],"db_accessions":[],"linked_datasets":[],"topics":[]}